ConferenceEngineeringArchitectural Engineering

International Conference on Architectural Engineering and Building Envelope Design

ICAEBED

Thu, May 21, 2026
Helsinki, Finland
About This Conference
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Call for Papers

architectural engineering
building envelope design
thermal insulation
facade engineering
energy efficiency
materials engineering
workflow optimization
project planning
engineering solutions
BIM integration
environmental monitoring
smart building technologies
sustainable architecture
design optimization
data analytics

Important Dates

Start Date

Thursday, May 21, 2026

Registration Deadline

Wednesday, May 6, 2026

Submission Deadline

Friday, May 1, 2026

Venue
Helsinki, Helsinki, Finland

Helsinki, Finland

Deadline: May 1, 2026

Official Website
Organizer

World Academics

John Richardson
Quick Info
TypeConference
CountryFinland
MonthMay-2026