ConferenceEngineeringMaterials Engineering

International Conference on Thin Films Engineering and Materials Applications

ICTFEMA

Thu, Jul 16, 2026
Colombo, Sri Lanka
About This Conference
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Call for Papers

Thin films
thin film deposition
sputtering techniques
chemical vapor deposition
physical vapor deposition
atomic layer deposition
epitaxial thin films
thin film characterization
semiconductor thin films
optical thin films
magnetic thin films
nanostructured thin films
thin film applications
sustainable thin film technologies
functional thin films in engineering

Important Dates

Start Date

Thursday, July 16, 2026

Registration Deadline

Wednesday, July 1, 2026

Submission Deadline

Friday, June 26, 2026

Venue
Colombo, Colombo, Sri Lanka

Colombo, Sri Lanka

Deadline: Jun 26, 2026

Official Website
Organizer

ISER

George Mathew (Abroad)
Quick Info
TypeConference
CountrySri Lanka
MonthJuly-2026