ConferenceEngineeringHeat Transfer

International Conference on Thermal Management in Electronics and Microdevices

ICTMEM

Wed, Aug 5, 2026
Innsbruck, Austria
About This Conference
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Call for Papers

thermal management
electronics
microdevices
heat dissipation
thermal engineering
computational modeling
system optimization
energy efficiency
heat sinks
thermal analysis
microelectronics
energy systems
convective heat transfer
thermal systems
electronic cooling

Important Dates

Start Date

Wednesday, August 5, 2026

Registration Deadline

Tuesday, July 21, 2026

Submission Deadline

Thursday, July 16, 2026

Venue
Innsbruck, Innsbruck, Austria

Innsbruck, Austria

Deadline: Jul 16, 2026

Official Website
Organizer
Quick Info
TypeConference
CountryAustria
MonthAugust-2026