ConferenceEngineeringHeat Transfer
International Conference on Thermal Management in Electronics and Microdevices
ICTMEM
Thu, Jul 30, 2026
Sepang, Malaysia
ConferenceEngineeringHeat Transfer
International Conference on Thermal Management in Electronics and Microdevices
ICTMEM
Thu, Jul 30, 2026
Sepang, Malaysia
About This Conference
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Call for Papers
thermal management
electronics
microdevices
heat dissipation
thermal engineering
computational modeling
system optimization
energy efficiency
heat sinks
thermal analysis
microelectronics
energy systems
convective heat transfer
thermal systems
electronic cooling
Important Dates
Start Date
Thursday, July 30, 2026
Registration Deadline
Wednesday, July 15, 2026
Submission Deadline
Friday, July 10, 2026
Venue
Sepang, Sepang, Malaysia
Sepang, Malaysia