ConferenceEngineeringHeat Transfer

International Conference on Thermophysical Properties and Heat Transfer Modeling

ICTPHTM

Sat, May 2, 2026
Osaka, Japan
About This Conference
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Call for Papers

thermophysical properties
heat transfer modeling
thermal engineering
energy efficiency
convective heat transfer
thermal analysis
system optimization
thermal management
material properties
heat exchangers
computational modeling
process engineering
thermal systems
energy systems
simulation techniques

Important Dates

Start Date

Saturday, May 2, 2026

Registration Deadline

Friday, April 17, 2026

Submission Deadline

Sunday, April 12, 2026

Venue
Osaka, Osaka, Japan

Osaka, Japan

Deadline: Apr 12, 2026

Official Website
Organizer

ISIT

Nathan Vincent
Quick Info
TypeConference
CountryJapan
MonthMay-2026