ConferenceEngineeringMaterials Engineering

International Conference on Thermal Properties and Materials Engineering Applications

ICTPME

Sat, May 30, 2026
Tainan, Taiwan
About This Conference
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Call for Papers

Thermal properties of materials
thermal conductivity
specific heat capacity
thermal expansion
thermal diffusivity
heat transfer in materials
phase change materials
high-temperature materials
thermal stability
thermal insulation materials
thermal analysis methods
thermomechanical properties
heat-resistant alloys
thermal management materials
advanced thermal property innovations

Important Dates

Start Date

Saturday, May 30, 2026

Registration Deadline

Friday, May 15, 2026

Submission Deadline

Sunday, May 10, 2026

Venue
Tainan, Tai-nan, Taiwan

Tainan, Tai-nan, Taiwan

Deadline: May 10, 2026

Official Website
Organizer

Research Fora

P. Roy Banerjee
Quick Info
TypeConference
CountryTaiwan
MonthMay-2026
    International Conference on Thermal Properties and Materials Engineering Applications | International Conference Alerts | International Conference Alerts